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Intel i9 10850K Benchmarks Spotted on Geekbench: A cheaper 10 Core Comet Lake CPU

According to recent reports, Intel is going to release a new 10-Core Comet Lake processor, the i9 10850K. This is probably Intel’s answer to the upcoming AMD Ryzen 3750X and the 3850X processors. But how a 10 Core/20 Threads processor will compare to a 16 Core/32 Threads processor remains to be seen.

Intel’s other 10 Core processor, the i9 10900K released in April but isn’t extensively available due to their supply chain issues that date all the way back to 2017. It seems that there has always been a shortage of Intel’s 14nm processors. The rumored i9 10850K will help in negating these issues while offering a cheaper alternative to the 10900K. According to Geekbench, it will feature a base clock speed of 3.6 GHz and boost up to 5.2 GHz, along with 20 MB of L3 cache. Compared to the i9 10900K, it’s around 100 MHz slower, both in base and boost clock speeds. Even the multi-core scores are slower by only 5%. Expect it to have the same power rating as the latter at 125W TDP.

Intel i910850K CPU benchmark
Source: Geekbench

While there’s no information as to if and when it will be available in retail, we can make some educated guesses. Firstly, since it is an unlocked processor (as can be determined from the ‘K’ moniker), we can expect it to not be a part of Apple’s upcoming iMac. Moreover, since it’s going to fill the gap between the i9 10900K and the i7 10700K, expect it to be priced around $400-$450, which is pretty good for a 10 Core processor. It will be interesting to see how it stacks up against the competition.

Stay tuned for more updates!

Further Reading:

Source: Geekbench

SK Hynix HBM2E fi

SK Hynix starts mass production of HBM2E: The world’s fastest DRAM solution

A little over a year ago SK Hynix unveiled their HBM2E memory, boasting industry-leading bandwidth. Compared to current-gen, it features 50% more bandwidth and twice as much capacity. The new SK Hynix HBM2E standard supports >460GB per second with 1024 I/Os based on the 3.6 GBps speed performance per pin. To put things into perspective, it can 124 movies with a 1080p resolution, each of size 3.7GB per second. Or it can transfer two separate installations of Call of Duty: Warzone in a second. Your pick.

To achieve this technological marvel, SK Hynix utilizes the TSV (Through Silicon Via) technology by vertically stacking eight 16-gigabit chips to form a single dense package of 16GB. Using TSV, the upper and lower parts of the chip are connected through thousands of fine holes on the DRAM chip. Column-shaped paths penetrate the entire thickness of the silicon wafer, delivering data, commands, and currents. HBM2E is closely interconnected with GPUs and logic chips that are separated by only a few µm, resulting in faster and more efficient data transfer speeds. Compared to HBM2(current-gen) memory, it 30% smaller in size and up to 50% more power-efficient, thanks to the new packaging technology.

It is built specifically for supercomputers, industrial GPUs, and next-gen AI systems including Deep Learning Accelerator, which requires high-level computing performance. It is also expected to be used in the Exascale supercomputer: a high-performance computing system that can perform calculations a quintillion times per second. Jonghoon Oh, Executive Vice President and Chief Marketing Officer (CMO) at SK Hynix hopes to lead the industry with their premium memory products.

For more updates, stay tuned!

Further Reading:

AMD Ryzen 7 4700G Flagship APU Benchmarks Leaked

AMD’s upcoming Ryzen 7 4700G APU has been leaked online by a Facebook page, ITCooker. The chip is a part of the Ryzen 4000 APU family called ‘Renoir’ and is supposedly the final retail design. The page has also provided benchmarks that give a fairly accurate idea regarding its performance.

The 4700G will feature AMD’s Zen2 architecture based on the 7nm process. While it is based on the same 7nm node as the Ryzen 3000 processors, the chip features a different rigid design, unlike the chiplet design of the latter. Based on the screenshots provided, it will have 8 Cores/16 Threads along with 8MB of L3 cache. It will feature a base clock of 3.6GHz and a boost clock of 4.5GHz. It will be compatible with the AM4 socket and has a power rating of 65W TDP.

The benchmark was done on an ASRock B500 Taichi motherboard using CPU-Z. Since graphics drivers aren’t available, only the CPU results are available. Speaking of graphics, the Ryzen 7 4700G packs quite a punch for an integrated GPU. It features 8 compute units and 512 cores clocked at 2100 MHz. Graphics benchmarks should become available soon as we near the launch of the APUs.

In the coming months, AMD will launch several of their ‘Renoir’ APUs featuring 4, 6, and 8 cores with both 35W and 65W TDP ratings. Like the Ryzen 3000 series, the APUs will support 3200MHz RAM natively, but the Vega iGPU would require a higher frequency RAM for enhanced performance. Both the B550 and X570 boards should help in getting more out of them.

In terms of pricing, expect the flagship 8 Core processors to be around $200-$250 and the budget 4 Core CPUs to be priced around $150-$200. The Renoir APUs are expected to launch next month and more details will become available soon.

Source: Wccftech